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Product Summary
Recently, embedded system developers face the challenge of upgrading LPDDR2 memory for new embedded SoC chips. Validation and testing of new designs can take considerable time, and when migrating from LPDDR2 to LPDDR4, designers must ensure signal integrity while meeting the tight timing margins of the LPDDR4 specification on a tight schedule. More resources need to be allocated, and this comes with various risks. However, LPDDR3 has the great advantage of having a 90% similarity to LPDDR2's design.
Adopted in many SoC chipset designs, Winbond Electronics' LPDDR3 is widely used in AIoT, AI inference chips, T-Con in 8K TVs, AI-enabled video processors, smart speakers, smart video doorphones, mobile POS systems, etc. Compatible with applications.
Product lineup
LPDDR3 1Gb series
| type name | input voltage | speed | Operating temperature range | Constitution | In-vehicle compatible |
| W63AH6NBV | 1.8V/1.2V | 800/933MHz/1066MHz | -25℃~85℃ -40℃~85℃ |
64Mbit x16 | - |
| W63AH2NBV | 1.8V/1.2V | 800/933MHz/1066MHz | -25℃~85℃ -40℃~85℃ |
32Mbit x32 | - |
LPDDR3 2Gb series
Please contact us from the bottom of the page for details as it is being revised.
LPDDR3 4Gb series
| type name | input voltage | speed | Operating temperature range | Constitution | In-vehicle compatible |
| W63CH6MBV | 1.8V/1.2V | 800/933MHz | -25℃~85℃ -40℃~85℃ |
256Mbit x16 | - |
| W63CH2MBV | 1.8V/1.2V | 800/933MHz | -25℃~85℃ -40℃~85℃ |
128Mbit x32 | - |
*Product family is designed based on JESD209 3rd industry standards.
*All Winbond products are halogen-free and packaged in accordance with the RoHS Directive.
* For inquiries and datasheets regarding KGD, please contact us from the following.
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Estimate
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