Certification Process and Testing Content for High-Reliability Upscreening for Space Applications

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Designing Analog Mini-Circuits

*This article is a simplified version of Mini-Circuits' AN-00-018. Please refer to AN-00-018 for details.

High reliability requirements and the need for upscreening in space applications

In space applications, rigorous certification of electronic components is essential due to harsh environments and the requirement for irreparable and failure-free operation. Mini-Circuits offers highly reliable testing and certification programs based on proven track records and experience.

This article explains the evaluation process and testing methods for upscreening for space applications, using LTCC filters as an example. Please note that actual requirements vary depending on the mission and program. For specific requirements, please contact us.

Examples of LTCC low-pass filters

LFCN-8400＋ — Figure 1: LFCN-8400+, LTCC Low Pass Filter, Passband DC-8400MHz, Maximum Power 8W

Mini-Circuits' LTCC passive components are characterized by their small size and high reliability, making them suitable for Hi-Rel applications, including space applications. Here, we will introduce the evaluation process for upscreening for space applications, using the LTCC low-pass filter (LFCN-8400+) as an example. This LTCC filter is an improved version of the LFCN-8400+, supporting a wide bandwidth (DC to 8400MHz) and high power (up to 8W), and is designed for harsh environments.

To meet space applications, the device must comply with special requirements such as lead-containing plating and lot control, and undergo various reliability evaluations including DPA and X-ray inspection. The following outlines the evaluation process performed on this device and describes the details of each test.

Destructive Physical Analysis (DPA)

Prior to reliability testing, DPA (Diagnostic and Peripheral Analysis) will be performed on three randomly selected samples to confirm the internal structure and terminal configuration. MIL-STD-1580 will be used as a guideline for evaluation, and the presence or absence of abnormalities will be confirmed through external and internal observation.
The external appearance and internal structure of the cut device are shown in Figures 2 and 3.

Figure 2: Overall view (18x magnification) / Figure 3: Image of the severed device using DPA

Reliability testing

Following DPA, reliability testing will be conducted. Reliability testing consists of two stages: screening testing and certification testing.

1. Screening test
All units (excluding those subject to DPA) will undergo X-ray inspection and other tests to confirm their flight suitability. However, no extreme tests that may affect performance will be conducted. Figure 4 shows an example of internal trace heterogeneity (cracks) detected by X-ray imaging.

2. Certification Exam
A selected group (Group B) will undergo more rigorous and detailed testing. The units will be divided into subgroups, each subject to different testing conditions.

Figure 4: Detection of non-uniformity (cracks) in the internal wiring of LTCC (Low-Temperature Coated Crystal) using X-ray imaging.

Units that have undergone screening testing only will be delivered as flyable units along with a report. Units used for certification testing, on the other hand, will be treated as non-flyable certification test samples, and a separate report will be provided. The main conditions for DPA, screening testing, and certification testing are summarized in Table 1. For details on the test methods, please refer to the respective MIL standards.

Table 1: Process overview in an example of an LTCC low-pass filter spatial upscreening project

Summary

The process described in this article is just one example based on the requirements of a specific mission; actual requirements will vary depending on the application and mission. Therefore, the application and test conditions of upscreening must be considered according to individual requirements. Mini-Circuits allows for the application of upscreening tailored to each mission.

We also offer evaluation processes to ensure compliance with MIL standards or equivalent standards for many of our catalog and custom products. Table 2 shows examples of applicable standards for major product categories. Our EEE-INST-002 compliant workflow enables in-house upgrade testing, with a turnaround time of as little as 90 days. This contributes to cost reduction and shorter project timelines. Please contact us for specific details regarding applicability and test content.

Technology Category	product	Applicable standards
Core & Wire	transformer	MIL-STD-981 for Family 11
	Power Divider
	coupler
LTCC	Listed in the Mini-Circuits catalog All LTCC components	Based on MIL-STD-202, Use an applicable test method.
Bare Dye (active and passive)	All die parts listed in the Mini-Circuits catalog	MIL-PRF-38534 Appendix D
Non-airtight SMT products	Frequency multiplier	MIL-PRF-38534 Appendix D
	Power Divider
	Lumped-parameter filter
PEMs (MMIC) Products	Amplifier	PEM-INST-001
	Attenuator
	transformer
	Filter (anti-reflective filter)

Table 2: Examples of applicable standards in major product categories

*Main evaluation items (standard tests) include burn-in tests, thermal shock tests, mechanical shock tests, airtightness tests, outgassing tests, and residual gas analysis. We also offer vibration tests, radiographic inspections, and destructive physical analysis (DPA).