What is the difference between modules and discretes?

Discrete products contain one or two dies (chips) in one package, and the packages are TO-220, TO-247, TO-3P, DPAK, TO-268, and other standard packages such as JEDEC. and has a wide variety of devices. The customer places these on the board one by one and connects them to form a circuit.

A modular product, on the other hand, combines several dies or more and connects them together in a single package. Electrically, it covers phase legs and full bridges. The external shape and dimensions are also different from discrete products.

There are many types of module product packages for each manufacturer, and there are similar ones, but unlike discrete packages, they are not standardized and each manufacturer has its own specifications. As an example, the rightmost module in the figure below is Microchip's SP6LI, a 3nH​ ​low-inductance package that helps improve switching characteristics, with dimensions of about 108mm x 62mm x 17mm. (Example: MSCSM120AM02CT6LIAG)

This is a SiC-MOSFET phase-leg (half-bridge) module with a withstand voltage of 1200V and an on-resistance of 2.6mΩ.

Advantages and disadvantages of modules

For example, multiple MOSFETs can be connected in parallel and operated in order to allow a large current to flow or to suppress the on-resistance. However, as the number of "parallel" increases, circuit design and board design tend to become more difficult, so in such cases there is an advantage to using modules. There are not only advantages, but also disadvantages of using modules. Therefore, the advantages and disadvantages of the module are described below.

merit
・Since the module contains multiple chips, there is no need to connect discrete devices in parallel on the board, which reduces circuit and board design.
• The module itself provides certain functions and electrical characteristics.
・There is a possibility that the substrate can be made smaller compared to assembling with discrete products, and the operating frequency can be increased with SiC,
Peripheral parts such as transformers and coils can be made smaller, and application equipment can be made smaller and power density can be improved.

Demerit
・In terms of board design and thermal design, it depends on the shape of the module and lacks flexibility.
・In some cases, the unit price is high, and it may be cheaper to arrange many discrete devices.

Therefore, it will be used properly according to the application, but in the future of decarbonization, it is expected that fields that handle large amounts of electric power, such as natural energy, power storage, and EV car-related fields, will expand greatly.

I think there will be more opportunities than ever before for SiC module products to be useful.

What are Microchip's module products?

Microchip has been in the module business for a long time, and offers products suitable for a wide range of applications including aerospace. We have a wide variety of power device chips, packages, etc., and release many module products that combine them with high quality. In addition to the standard products, we also provide custom modules according to the customer's application.

Microchip's module products include those that use SiC, as well as those that incorporate Si MOSFETs, IGBTs, and Diodes. Among them, there are roughly the following types of SiC modules. Originally, we would have posted a list of product names here, but since there are many varieties, we will provide a link to the material on the manufacturer's website, which is listed separately.
There are too many to introduce here, so please click here to see the manufacturer's materials.

Micochip SiC module types and circuit formats

Inquiry

If you have any questions regarding this article, please contact us below.