Introduction

In this article, we have summarized the three most common development issues that are frequently consulted by audio equipment developers and designers! We also have a solution to the problem, so please take a look at the end.

 

[Target application examples]

・Video conferencing system

・Smart speaker

・360° surround microphone

・ICrecorder

·headphone

・Foldable audio player

・Communication robot

Solved with FPGA! 3 selections of audio equipment development issues

1. Due to the increase in the number of microphones, the number of SoC ports has become insufficient

The number of microphones is increasing in the design of audio equipment.Many designers face the problem that thenumber of microphones has increased in order to improve sound quality, and the number of SoC ports that receive microphone signals has become insufficient. Are you forced to change the SoC to increase the number of ports, resulting in increased costs?

 

2. Due to the miniaturization of the housing, wiring in narrow spaces has become difficult.

In the design of mobile audio equipment, there is a trend toward miniaturization of housings. Nevertheless, when trying to improve the sound quality and operability of the microphone, there are cases where the board and wiring increase and internal wiring becomes difficult. Doesn't it lead to changing the mechanical parts or unavoidably increasing the housing size as a result of trying to realize the function forcibly?

3. The processing load of the main IC such as SoC is increasing

SoCsmain such asI Cto theAre you concentrating too much functionality? meWe often hear of problems such as a decrease in processing speed and heat generation due to an increase in power consumption due to an increase in the processing load of the in-IC. Doesn't changing the SoC to improve the functionality of the main IC lead to an increase in cost?


What do you think. You must have had at least one experience in audio equipment design. Next, I will explain specific solutions to the above three issues.

Problem solving! Lattice Solution

1. Due to the increase in the number of microphones, the number of SoC ports has become insufficient

FPGAs from Latticeis pluralchmultiplexes the audio signals ofSoCscan be transmitted toSoCsport shortage. In the future, the only purpose is to increase the number of portsSoCsThis eliminates the need for upgrades, leading to a reduction in total costs.

As shown in the image below, multiplechofI2S, PDMof1chofTDMcan be aggregated tomultiplechofPDMof1chofTDMWhen changing to , arithmetic processing is required for format conversion, but inside16x16 DSP BlockThere is also a device with a small package size of 2.1 x 2.1 mm at the minimum.

In this case Buffer As FPGA Although it may use internal memory, Lattice Allows for ultra-low consumption and small logic despite max 1 Mbit Some devices are equipped with internal memory, so it is possible to aggregate multiple PDMs with plenty of memory resources.

Ultra-low power consumption, depending on specification(Standby current30uA)Suggestions are also possible.1.4x1.4mmThe ultra-small package is available, so even products with a small board area can be mounted without space constraints.

2. Due to the miniaturization of the housing, wiring in narrow spaces has become difficult.

I2C/I2S/UART/GPIO on Lattice FPGASignals from various sensors that interface withFPGAmultiplexed within one signal line/Receiving the signal solves the problem of wiring in narrow spaces. In the future, there will be no need to change the mechanical parts or increase the size of the housing to solve problems related to wiring that have become difficult.

Also, this solutionIt is possible to flexibly customize the required number of channels.minimum2.5mSmall square package, standby current75uAIt can be realized with the following ultra-low power consumption devices.

3. The processing load of the main IC such as SoC is increasing

Main Some of the processing that was concentrated on the IC, leaving the audio digital processing to the FPGA,MainI CIt is possible to reduce the processing load of In the future, by improving the function of the main ICNo need to worry about cost increase.

Parallel processing possibleFPGAAmong the,Latticehas the strength of low power consumption,SoCssome processing ofLattice FPGAsBy letting theIt may improve system performance.

For audio processing, the FIR shown in the figure belowfilter (right), orFFTFilter (left)Use the.

 

Document download

If you would like to know the specific product name and package lineup that can realize the above solution, please refer to the document from the link below.

 

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