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In order to maximize the performance of a high-speed serial link, optimal setting of link equalization and transceiver/receiver electrical parameters takes into consideration the characteristics of wiring, cables, connectors, and devices on the other end of the board. is needed. However, debugging while using a measuring instrument after manufacturing a board takes time, and commercially available transmission path analysis tools are expensive. |
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| JNEye provided by Intel® supports hybrid analysis that mixes high-speed static analysis and high-precision time-domain (dynamic) analysis. to simulate. For example, if the time domain analysis takes 20 minutes, the simulation will be completed in about 2 minutes for static analysis and about 4 minutes for hybrid analysis. |
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Features of JNEye
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Free for Subscription Edition Quartus II Users |
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ジッタ、反射、クロストーク、挿入/反射損失などの SI (Signal Integrity)解析が可能 |
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Simulation time is several minutes (hybrid analysis) |
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Easy operation with push button |
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Supports three simulation modes: static analysis, time domain analysis and hybrid analysis |
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View compliance masks for standards such as PCI Express® |
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Waveforms of JNEye simulation results and actual measurement results can be compared |
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Allows consideration of PVT (process, voltage, temperature) variations |
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Built-in Arria 10 GX/GT, Stratix V GX/GT, Arria V GZ libraries as standard |
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Supports industry standard models such as IBIS-AMI and Touchstone S-parameters for non-Intel device analysis |
Abundant GUI (Graphical User Interface)
JNEye has a rich GUI to facilitate analysis of high speed serial links.
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Link Designer |
Channel Viewer |
Data Viewer |
Correlation |
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Topology (pseudo-circuit) |
Analysis of noise rate as a function of frequency |
Analysis in eye diagram |
Comparison of simulation results and measurement data from actual equipment |
JNEye reference information
| JNEye webinar (English version: 8 minutes) | |
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Fast and Accurate High-Speed Serial Channel Design with the JNEye Link Analysis Tool |
| White Paper (English / PDF: 2.66 MB) | |
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A Significant Technology Advancement in High-Speed Link Modeling and Simulation (English・PDF：2.66 MB) |