Infineon's XENSIV™ MEMS analog microphone IM73A135 sets new performance benchmarks for MEMS microphones. Best-in-class signal-to-noise ratio (SNR) of 73dB and high acoustic overload point (AOP) of 135 dBSPL enable clear audio pickup from the softest to the loudest.
The microphone is based on Infineon's new shielded dual-membrane (thin-film) MEMS technology, which provides high dust protection (IP57) at the microphone level. The IM73A135 enables designers to enjoy the unique advantages of MEMS technology while achieving high sound quality performance previously only achievable with ECM.

Main features
・ Very low self-noise / very high SNR (73dB)
・ Selectable for applications that require battery power saving
Power mode (170/70μA)
・ SDM (Sealed Dual Membrane) technology provides IP57 protection at the microphone level
Achieves dust-proof performance
- Ultra-high dynamic range and very high acoustic overload point
(AOP) Achieves 135dBSPL
Very tight part-to-part phase and sensitivity matching (±1dB)
-Flat frequency response with a very low LFRO (low frequency roll-off) of 20Hz
・ Very low group delay (2 μs @ 1 kHz)

IM69D127 is a digital high-performance MEMS microphone based on Infineon's new shielded dual-membrane MEMS technology, which provides high waterproof/dustproof (IP57) at microphone' level. Its small size of only 3.6 x2.5 x 1.0 mm makes it ideal for compact audio equipment such as TWS earphones.

Main features
・ Very low self-noise / very high SNR (69 dB)
・ Selectable for applications that require battery power saving
power mode
・ SDM (Sealed Dual Membrane) technology provides IP57 protection at the microphone level
Achieves dust-proof performance
・ Small package size (3.6 × 2.5 × 1.0mm)
- Phase and sensitivity matching between very tight parts (±1dB)
・ Low frequency roll-off (LFRO) of 40Hz and flat frequency response
・ Extremely low group delay (9μs)