Category: Simulation
Tools: HyperLynx® SI (Mentor Graphics®)
device:-

General semiconductors are packaged by connecting wires (wire bonds or substrates) to pins to silicon (so-called die).

In other words, there is a wiring between the die and the pin, so there is a difference in the waveform between at Pin and at Die due to this effect.

Specifically, on the IBIS model, the wiring is
・L_pkg (inductance)
・R_pkg (resistance)
・C_pkg (capacitance)
Since it is defined as, this effect causes a difference.