No, in addition to heat dissipation, it may also be used for strengthening GND.

It also depends on the type of device. For example, the exposed pad of a power supply IC often doubles as the power GND, and many products require low-impedance connection because a large current flows through it. Microcomputers and DSPs may also serve as GND for digital circuits, so I think that there are many devices that need to firmly solder the Exposed PAD to strengthen the GND inside the IC. I hope you will read the notes carefully.

(Published in November 2022)

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