Overview

This article contains a press release from Winbond Electronics.

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, and STMicroelectronics (NYSE: STM), a global leader in semiconductors serving a variety of electronic application areas, today announced the launch of Winbond Specialty Memory. and announced a partnership to link modules with ST 's STM32 microcontrollers (MCUs) and microprocessors (MPUs).

This partnership agreement ensures the long-term availability of Winbond and ST devices and formalizes the cooperation between the two companies to meet the needs of industrial customers.

“This partnership will enable the Company developers to confidently embed the Company memory into STM32 devices. It simplifies interconnections and reduces PCB costs, making it a great choice for embedded projects,” said Tetsu HO, DRAM Technology Manager at Winbond Electronics.

The STM32 family is the market leader in MCUs and MPUs based on industry-standard Arm® Cortex 32-bit cores. Ultra-low power consumption, advanced peripherals, software, tools, and evaluation boards / kits for superior performance and energy efficiency combined with the extensive STM32 ecosystem to enable easier and faster development .

“STMicroelectronics and Winbond are pleased to announce our close partnership on the STM32MPU family. ST, as a global leader in general-purpose microcontrollers, is expanding its STM32MPU family, but to do so, it needs a leading DRAM provider.” ”said Kamel Kholti, Product Marketing Manager at STMicroelectronics.

The partnership currently focuses on a combination of Winbond's DRAM (DDR3) and ST 's MPU (STM32MP1). This MPU features up to two​ ​Cortex-A7 cores and integrates on-chip features such as advanced peripherals, IoT security hardware, and high-efficiency power conversion circuitry. Winbond's DDR3 supports MPU 's memory buffer and performance in many applications that require high performance and state-of-the-art security, such as industrial gateways, data concentrators, smart meters, barcode readers and smart home devices. improve.

In addition, the two companies have worked together to ensure that Winbond's HYPERRAM provides optimal support for the memory buffers of ST 's recently announced ultra-low-power MCU​ ​STM32U5, which features an advanced Cortex-M33 core. HYPERRAM enables replacement of older interfaces such as SDR and older generation DDR, resulting in overall system power reduction. It improves the performance of traditional pSRAM and enables high speed, low cost, low pin count and ultra low power solutions similar to the ultra low power STM32U5.