Overview

This article contains a press release from Winbond Electronics.

Winbond Electronics Co., Ltd., a leading global supplier of semiconductor memory solutions, today announced Elecfans' seventh announced that it won the China IoT Innovation Awards 2022.

Founded by Elecfans, China's leading electronic media, the China IoT Innovation Awards is recognized as one of the most professional and influential innovations in China's IoT industry. The China IoT Innovation Awards selects and rewards outstanding technologies and leaders in the IoT industry, as well as innovative products that have been highly praised and recognized by the market and industry users in the past few years, to promote the progress of IoT technology and the development of the industry. It aims to enlighten as many people as possible to contribute to

HYPERRAM products offer a compact alternative to traditional pseudo-SRAM and are suitable for low-power, space-constrained IoT applications requiring off-chip external RAM. HYPERRAM 3.0 is the third generation of the HYPERRAM family and operates at a maximum frequency of 200MHz and an operating voltage of 1.8V.
This is the same as HYPERRAM 2.0 and OCTAL xSPI RAM, but with a data transfer rate of 800MBps, twice as fast as before. The new generation of HYPERRAM works with a 22-pin extended I/O HYPERBUS(TM) interface.

Three key features of HYPERRAM are low pin count, low power consumption, and easy control, which help improve the performance of IoT end devices. HYPERRAM greatly simplifies PCB layout design, extends battery life in mobile devices, and improves throughput compared to Low Power DRAM, SDRAM, and CRAM/PSRAM while operating with fewer pin counts and smaller processors To do.

According to IResearch, China's AIoT industry will enter a period of rapid growth in 2022, and the demand for IoT chips and smart devices will soar accordingly. The winning of the China IoT Innovation Awards for HYPERRAM 3.0 is a recognition of Winbond's continuous innovation. The HYPERRAM family is ideal for low-power IoT applications such as wearables, automotive instrument clusters, infotainment, telematics systems, industrial machine vision, HMI displays and communication modules.

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