The newly announced four series of multilayer chip inductors are optimized for RF applications, offering a compact, thin design and excellent high-frequency characteristics.

Riverside, California – February 23, 2026 – Bourns, a leading manufacturer of electronic components for power, protection, and sensing solutions, announced four new series of multilayer chip inductors (CE0603G, CE0603M, CE1005Q, and CE1608Q). These new products feature a monolithic structure enabled by advanced multilayer technology, providing power electronics designers with high reliability, stability, and superior signal quality. The four series are available in compact form factors ranging from 1608 and 1005 sizes to a minimum of 0603mm, offering a wide range of options to meet miniaturization needs.

To improve performance in high-frequency circuits, the new chip inductors feature a high self-resonant frequency (SRF) of up to 20,000 MHz, tight inductance tolerances, and current ratings of 100 mA to 1000 mA. These four high-SRF inductor series have a wide operating temperature range of -55°C to +125°C and are optimized for RF amplifiers, low-voltage power modules, radio transmitters, radar, wireless communication equipment, and various mobile electronic devices.

The Bourns® CE0603G, CE0603M, CE1005Q, and CE1608Q series multilayer chip inductors are currently available and are RoHS compliant (*1).

For more details, please visit the Bourns website.

　※1：RoHS Directive 2015/863, Mar 31, 2015 and Annex.

product page

For detailed information on all multilayer chip inductor products, including CE0603G, CE0603M, CE1005Q, and CE1608Q, please visit the Bourns page.

• Multilayer chip inductor products
• CE0603G
• CE0603M
• CE1005Q
• CE1608Q

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