Bourns® BTJ Series Thermal Jumpers' high thermal conductivity and insulating properties help protect and extend the life of system components

Riverside, Calif. — December 18, 2025 — Bourns, a leading manufacturer of electronic components for power, protection, and sensing solutions, introduces the BTJ Series Thermal Jumper Chip, which provides effective heat dissipation in a compact form factor. These unique devices combine high thermal conductivity with insulating properties to help protect and extend the life of system components. The thermal jumper chip quickly dissipates heat while not conducting electricity, ensuring uninterrupted system operation.

Bourns' new thermal jumper chip, available in an SMD package, provides an excellent heat dissipation solution for a variety of mobile and electronic devices, including power supplies, converters, RF and GaN amplifiers. Furthermore, this advanced design leverages the chip's insulating properties to fill the space between the heating element and the temperature-sensing element, enabling highly accurate temperature sensing. These features reduce temperature rise in key components, contributing to improved system-level reliability.

Bourns® BTJ Series Thermal Jumper Chips are currently available and are RoHS compliant(※1) and halogen-free(※2).

For more information, please visit the Bourns website.

　※1：RoHS Directive 2015/863, Mar 31, 2015 and Annex.
※2：Bourns considers a product to be "halogen free" if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less;
　　   and (c) the total Bromine (Br) and Chlorine (Cl) content is 1500 ppm or less.

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For more information on our complete line of thermal management products and the BTJ series thermal jumper chips, please visit the Bourns page.

• Heat Dissipation Device Products
• BTJ Series Thermal Jumper Chip

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